Developing new products involves knowing the behavior of ingredients in the various stages of its elaboration. In this study, cookies were developed from the mixture of refined wheat flour/whole-wheat flour, added of emulsifying ingredients such as egg yolk powder (EYP), sunflower meal (SF), prepared by Fraunhofer-IVV, and emulsifier (DATEM), In order to verify the possibility of totally or partially replacing animal protein (egg) and chemical additive (emulsifier) contents. The aim of the study was to determine analytical parameters of the quality of developed cookies, through correlations between the dough rheological properties and the technological quality of the cookies. The design for the preparation of cookies was a simplex-centroid mixture, with independent variables expressed in pseudocomponents, being the mixture of refined wheat flour/whole-wheat flour (49/51%), added with EYP and SF, ranging from 0 to 5.8% and the DATEM emulsifier, from 0 to 1%. The rheological properties of dough were measured in farinograph(AACCI-54-21.02), viscosity profile in RVA(ICC-162), density and rheological analysis (TPA) in TA.XT2i texturometer. Cookies were analyzed for physical dimensions, instrumental texture and water activity (Aw). In general, a higher correlation (r>0.61 to 0.88) was observed between the farinographic parameters and analysis of density and hardness/TPA, and there was also a correlation between cookies, instrumental texture (r=-0.60), Aw (r=-0.61) and cookie dimensions (r=0.71) with the firmness/TPA parameter of the dough, as well as a large correlation of the final viscosity (RVA) with cookie dough parameters. It is concluded that the results of the farinographic properties (Development Time, Departure Time and Stability) can be used as indicators of quality of cookies dough (density and hardness/TPA), with great influence of the emulsifier (DATEM), as well as final viscosity (RVA) of the dough and Aw of the cookies to evaluate the behavior of the sunflower meal(SF) addition in the cookies formulations.