Interrelationship of thermal parameters and microstructure of Bi-Zn solder alloys
Due to the health and environmental concerns associated with lead usage, the research on alternative lead-free alloys for replacing lead-based solders is a global demand. In this sense, particular lead-free alloys compositions have been suited for specific needs and the options have been broadening when elements other than tin are used as the base component, such as indium, gold and bismuth.Thus, this study aims to contribute towards understanding the influence of thermal parameters of Bi-2.7%Zn